At the forefront of semiconductor technological innovation, we are dedicated to providing cutting-edge solutions that drive efficiency and excellence in every aspect of your business. Our team of experts ensures that we deliver robust, reliable, and tailored technology services to meet the unique needs of our clients.

Harnessing Singapore’s market agility and Taiwan’s global foundry dominance, we deliver cutting-edge semiconductor solutions with unmatched precision and scalability. Our world-class engineering expertise ensures high-yield, reliable substrates and devices, driving innovation in front-end and back-end processes.

Leveraging Taiwan’s engineering prowess, we deliver tailored solutions that enhance yield, accelerate time-to-market, and ensure reliability. Trust our expertise to streamline processes and empower your team, positioning your projects for success in a competitive market.

Our SiC, GaN, GaAs, and InP Wafers deliver high electron mobility (up to 8500 cm²/V·s) and direct bandgaps for 5G, optoelectronics, and aerospace. With low-defect epitaxy and scalable 6–8-inch substrates, we empower high-frequency, high-efficiency devices.

Our SiC MOSFETs, SiC Diodes, and GaN HEMTs deliver >98% efficiency and high-frequency operation for EVs and renewable energy. With low on-resistance and thermal resilience, these devices enable compact, reliable designs. Choose us for automotive-grade solutions that meet stringent JEDEC standards and power your innovations.

Our Thermal Interface Materials (TIMs) enable efficient heat dissipation for high-performance electronics. With excellent compressibility and robust insulation, our TIMs ensure reliability in compact devices. Partner with us to enhance thermal performance in consumer electronics, 5G, and data centers, driving efficiency and longevity.

Our Aluminum Silicon Carbide metal matrix composites provide lightweight strength and superior thermal management for semiconductors and aerospace. Tailored SiC content ensures durability and cost efficiency. Partner with us to optimize high-power electronics and structural components with industry-leading reliability.

Our back-end services deliver high-precision testing, assembly, and packaging for semiconductor reliability. From wafer probing to advanced packaging, we ensure defect-free performance and scalability. Trust our ISO 9001-certified processes to streamline your supply chain and accelerate market readiness with robust, high-yield solutions.

Our Industry 4.0-driven smart manufacturing leverages AI and IoT for real-time process optimization. With high-throughput, low-defect production, we ensure cost-efficient, scalable semiconductor solutions. Partner with us to achieve unparalleled yield and agility, meeting the demands of next-generation electronics markets.